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1. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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2. 
Cover image for Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Author 
Jin, Helena. editor. Sciammarella, Cesar. editor. Yoshida, Sanichiro. editor. Lamberti, Luciano. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06986-9
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3. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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4. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3627-0
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5. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-642-40170-1
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6. 
Cover image for Physics of Semiconductor Devices
Physics of Semiconductor Devices
Author 
Rudan, Massimo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1151-6
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7. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09647-6
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8. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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9. 
Cover image for Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Author 
Fan, Jiyang. author. Chu, Paul K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08726-9
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10. 
Cover image for Piezoresistor Design and Applications
Piezoresistor Design and Applications
Author 
Doll, Joseph C. author. Pruitt, Beth L. author. SpringerLink (Online service)
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ONLINE(332425.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-8517-9
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11. 
Cover image for Introductory MEMS Fabrication and Applications
Introductory MEMS Fabrication and Applications
Author 
Adams, Thomas M. author. Layton, Richard A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-09511-0
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12. 
Cover image for Mechatronische Systeme Grundlagen
Mechatronische Systeme Grundlagen
Author 
Isermann, Rolf. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-32512-3
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13. 
Cover image for Electrical Craft Principles, Volume 1
Electrical Craft Principles, Volume 1
Author 
Whitfield, J.
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http://dx.doi.org/10.1049/PBNS033E
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14. 
Cover image for Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-32642-7
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15. 
Cover image for Fast Simulation of Electro-Thermal MEMS Efficient Dynamic Compact Models
Fast Simulation of Electro-Thermal MEMS Efficient Dynamic Compact Models
Author 
Bechtold, Tamara. author. Rudnyi, Evgenii B. author. Korvink, Jan G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-34613-5
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16. 
Cover image for Adaptronics and Smart Structures Basics, Materials, Design and Applications
Adaptronics and Smart Structures Basics, Materials, Design and Applications
Author 
Janocha, Hartmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-71967-0
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17. 
Cover image for Microscale Diagnostic Techniques
Microscale Diagnostic Techniques
Author 
Breuer, Kenneth S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137604
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