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1. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Multinational Companies, Knowledge and Technology Transfer Turkey's Automotive Industry in Focus
Multinational Companies, Knowledge and Technology Transfer Turkey's Automotive Industry in Focus
Author 
Sönmez, Alper. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332898.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-02033-4
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3. 
Cover image for Integrated Systems, Design and Technology 2010 Knowledge Transfer in New Technologies
Integrated Systems, Design and Technology 2010 Knowledge Transfer in New Technologies
Author 
Fathi, Madjid. editor. Holland, Alexander. editor. Ansari, Fazel. editor. Weber, Christian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-17384-4
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4. 
Cover image for The Theory of Laser Materials Processing Heat and Mass Transfer in Modern Technology
The Theory of Laser Materials Processing Heat and Mass Transfer in Modern Technology
Author 
Dowden, John. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-9340-1
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