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1. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Author 
Guha, Koushik. editor. Saha, Samar Kanti. editor. (orcid)0000-0002-5687-591X Iannacci, Jacopo. editor. (orcid)0000-0001-6462-4814 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-3758-4
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2. 
Cover image for Sensors and Microsystems Proceedings of AISEM 2025
Sensors and Microsystems Proceedings of AISEM 2025
Author 
Di Natale, Corrado. editor. Lorenzelli, Leandro. editor. Mulloni, Viviana. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-032-08271-8
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3. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Author 
Lenka, Trupti Ranjan. editor. (orcid)0000-0002-8002-3901 Saha, Samar K. editor. (orcid)0000-0002-5687-591X Fu, Lan. editor. (orcid)0000-0002-9070-8373 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4495-8
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4. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62546-6
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5. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
Author 
Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
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https://doi.org/10.1007/978-3-031-04492-2
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6. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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7. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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8. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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9. 
Cover image for Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Author 
Suri, Manan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-3703-7
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10. 
Cover image for Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems
Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems
Author 
Nath, Vijay. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-2999-8
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11. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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12. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-39361-2
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13. 
Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
Outlook and Challenges of Nano Devices, Sensors, and MEMS
Author 
Li, Ting. editor. Liu, Ziv. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50824-5
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14. 
Cover image for Nanovate Commercializing Disruptive Nanotechnologies
Nanovate Commercializing Disruptive Nanotechnologies
Author 
Anis, Mohab. author. AlTaher, Ghada. author. Sarhan, Wesam. author. Elsemary, Mona. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44863-3
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15. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-2720-8
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16. 
Cover image for Frontiers in Electronic Technologies Trends and Challenges
Frontiers in Electronic Technologies Trends and Challenges
Author 
Prabaharan, S.R.S. editor. Thalmann, Nadia Magnenat. editor. (orcid)0000-0002-1459-5960 Kanchana Bhaaskaran, V. S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4235-5
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17. 
Cover image for Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Author 
Vourkas, Ioannis. author. Sirakoulis, Georgios Ch. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-22647-7
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18. 
Cover image for Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Author 
Kaushik, B.K. author. Kumar, V. Ramesh. author. Patnaik, Amalendu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-0800-9
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19. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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20. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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21. 
Cover image for Carbon for Sensing Devices
Carbon for Sensing Devices
Author 
Demarchi, Danilo. editor. Tagliaferro, Alberto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08648-4
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22. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47023-7
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23. 
Cover image for Comparators in Nanometer CMOS Technology
Comparators in Nanometer CMOS Technology
Author 
Goll, Bernhard. author. Zimmermann, Horst. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44482-5
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24. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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25. 
Cover image for Flip-Flop Design in Nanometer CMOS From High Speed to Low Energy
Flip-Flop Design in Nanometer CMOS From High Speed to Low Energy
Author 
Alioto, Massimo. author. Consoli, Elio. author. Palumbo, Gaetano. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01997-0
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26. 
Cover image for Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Author 
Baskin, Lev. author. Neittaanmäki, Pekka. author. Plamenevskii, Boris. author. Sarafanov, Oleg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15105-2
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27. 
Cover image for Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Author 
Nazarov, Alexei. editor. Balestra, Francis. editor. Kilchytska, Valeriya. editor. Flandre, Denis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08804-4
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