Limit Search Results
Author
Wong, C.P. editor.
(3)
Kuang, Ken. editor.
(2)
Ouyang, Yun. editor.
(2)
Ren, Yuhui. editor.
(2)
Xu, Min. editor.
(2)
Language
Publication Date
-
Subject
Electronics.
(12)
Engineering.
(10)
Optical materials.
(9)
Chemistry.
(6)
Nanotechnology.
(6)
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
31 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Packaging for Sustainability
Packaging for Sustainability
Author 
Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-988-8
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Bionanocomposites for Packaging Applications
Bionanocomposites for Packaging Applications
Author 
Jawaid, Mohammad. editor. Swain, Sarat Kumar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-67319-6
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78219-5
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Fuel Cell Electronics Packaging
Fuel Cell Electronics Packaging
Author 
Kuang, Ken. editor. Easler, Keith. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47324-6
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Packaging for Food Preservation
Packaging for Food Preservation
Author 
Del Nobile, Matteo Alessandro. author. Conte, Amalia. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332324.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-7684-9
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0984-8
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Nanopackaging Nanotechnologies and Electronics Packaging
Nanopackaging Nanotechnologies and Electronics Packaging
Author 
Morris, James E. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47325-3
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
Format: 
Availability 
Online Library~1
Available:
Copies: