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1. 
Cover image for The Contribution of Technology to Added Value
The Contribution of Technology to Added Value
Author 
Fernandes, António S.C. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331113.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-5001-5
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2. 
Cover image for Recent Advancement in White Biotechnology Through Fungi Volume 2: Perspective for Value-Added Products and Environments
Recent Advancement in White Biotechnology Through Fungi Volume 2: Perspective for Value-Added Products and Environments
Author 
Yadav, Ajar Nath. editor. Singh, Sangram. editor. Mishra, Shashank. editor. Gupta, Arti. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-030-14846-1
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3. 
Cover image for Extremophilic Microbial Processing of Lignocellulosic Feedstocks to Biofuels, Value-Added Products, and Usable Power
Extremophilic Microbial Processing of Lignocellulosic Feedstocks to Biofuels, Value-Added Products, and Usable Power
Author 
Sani, Rajesh K. editor. Krishnaraj Rathinam, Navanietha. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-74459-9
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4. 
Cover image for Sustainable Bioenergy and Bioproducts Value Added Engineering Applications
Sustainable Bioenergy and Bioproducts Value Added Engineering Applications
Author 
Gopalakrishnan, Kasthurirangan. editor. van Leeuwen, J. (Hans). editor. Brown, Robert C. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-2324-8
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5. 
Cover image for Finanzierung durch Corporate Venture Capital und Venture Capital Empirische Untersuchung zum Value Added junger, innovativer Unternehmen in Deutschland
Finanzierung durch Corporate Venture Capital und Venture Capital Empirische Untersuchung zum Value Added junger, innovativer Unternehmen in Deutschland
Author 
Neubecker, Jochen. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-8350-9087-3
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6. 
Cover image for Designing and Evaluating Value Added Services in Manufacturing E-Market Places
Designing and Evaluating Value Added Services in Manufacturing E-Market Places
Author 
Perrone, G. editor. Bruccoleri, M. editor. Renna, P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-3152-1
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7. 
Cover image for Computer Science and Education in Computer Science 19th EAI International Conference, CSECS 2023, Boston, MA, USA, June 28-29, 2023, Proceedings
Computer Science and Education in Computer Science 19th EAI International Conference, CSECS 2023, Boston, MA, USA, June 28-29, 2023, Proceedings
Author 
Zlateva, Tanya. editor. Tuparov, Georgi. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520698.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-44668-9
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8. 
Cover image for Responsive and Sustainable Educational Futures 18th European Conference on Technology Enhanced Learning, EC-TEL 2023, Aveiro, Portugal, September 4-8, 2023, Proceedings
Responsive and Sustainable Educational Futures 18th European Conference on Technology Enhanced Learning, EC-TEL 2023, Aveiro, Portugal, September 4-8, 2023, Proceedings
Author 
Viberg, Olga. editor. Jivet, Ioana. editor. Muñoz-Merino, Pedro J. editor. Perifanou, Maria. editor. Papathoma, Tina. editor.
Preferred Shelf Number 
XX(521121.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-42682-7
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9. 
Cover image for Computational Science and Its Applications - ICCSA 2023 Workshops Athens, Greece, July 3-6, 2023, Proceedings, Part VII
Computational Science and Its Applications - ICCSA 2023 Workshops Athens, Greece, July 3-6, 2023, Proceedings, Part VII
Author 
Gervasi, Osvaldo. editor. (orcid) Murgante, Beniamino. editor. (orcid) Rocha, Ana Maria A. C. editor. (orcid) Garau, Chiara. editor. (orcid) Scorza, Francesco. editor.
Preferred Shelf Number 
XX(521013.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-37123-3
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10. 
Cover image for Mobile Web and Intelligent Information Systems 19th International Conference, MobiWIS 2023, Marrakech, Morocco, August 14-16, 2023, Proceedings
Mobile Web and Intelligent Information Systems 19th International Conference, MobiWIS 2023, Marrakech, Morocco, August 14-16, 2023, Proceedings
Author 
Younas, Muhammad. editor. Awan, Irfan. editor. Grønli, Tor-Morten. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521302.1)
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https://doi.org/10.1007/978-3-031-39764-6
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11. 
Cover image for Internet of Things. IoT Infrastructures First International Summit, IoT360 2014, Rome, Italy, October 27-28, 2014, Revised Selected Papers, Part II
Internet of Things. IoT Infrastructures First International Summit, IoT360 2014, Rome, Italy, October 27-28, 2014, Revised Selected Papers, Part II
Author 
Giaffreda, Raffaele. editor. Cagáňová, Dagmar. editor. Li, Yong. editor. Riggio, Roberto. editor. Voisard, Agnès. editor.
Preferred Shelf Number 
XX(518534.1)
Electronic Access 
https://doi.org/10.1007/978-3-319-19743-2
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