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1. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
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2. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
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3. 
Cover image for Electronic packaging science and technology
Electronic packaging science and technology
Author 
Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.
Preferred Shelf Number 
TK7870.15 .T85 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
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4. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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5. 
Cover image for Functional polyimide dielectrics : structure, properties, and applications
Functional polyimide dielectrics : structure, properties, and applications
Author 
Zha, Jun-Wei, editor.
Preferred Shelf Number 
TK7872 .D53 F86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527849031
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6. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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7. 
Cover image for Planar microwave sensors
Planar microwave sensors
Author 
Martín, Ferran, 1965- author. Vélez, Paris, author. Muñoz-Enano, Jonathan, author. Su, Lijuan, author.
Preferred Shelf Number 
TK7876 .M22 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119811060
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8. 
Cover image for Inkjet printing in industry : materials, technologies, systems, and applications
Inkjet printing in industry : materials, technologies, systems, and applications
Author 
Zapka, Werner, editor.
Preferred Shelf Number 
Z252.5 .I48 I55 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527828074
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9. 
Cover image for Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Author 
Domingo, George, 1937- author.
Preferred Shelf Number 
TK7871.85 .D66 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124
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10. 
Cover image for Lead-free soldering process development and reliability
Lead-free soldering process development and reliability
Author 
Bath, Jasbir, editor.
Preferred Shelf Number 
TK7870.15 .L434 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093
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11. 
Cover image for Harsh environment electronics : interconnect materials and performance assessment
Harsh environment electronics : interconnect materials and performance assessment
Author 
Sharif, Ahmed, editor.
Preferred Shelf Number 
TK7871
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964
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12. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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