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1. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
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2. 
Cover image for Aseptic processing and packaging of food products
Aseptic processing and packaging of food products
Author 
Holdworth, S. D.
Preferred Shelf Number 
TP 371.2 H65 1992
Format: 
Availability 
Beytepe Library~1
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3. 
Cover image for Lead-free soldering in electronics science, technology and environmental impact
Lead-free soldering in electronics science, technology and environmental impact
Author 
Suganuma, Katsuaki.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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4. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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5. 
Cover image for IC component sockets
IC component sockets
Author 
Liu, Weifeng. Pecht, Michael. John Wiley & Sons.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html
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6. 
Cover image for Başarılı ambalaj başarılı pazarlama = the marketer's guide to successful package design
Başarılı ambalaj başarılı pazarlama = the marketer's guide to successful package design
Author 
Meyers, Herbert M. Lubliner, Murray J. Üsdiken, Zehra.
Preferred Shelf Number 
HF 5770 .M4920 2004
Format: 
Availability 
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