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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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2. 
Cover image for Phase diagrams : materials science and technology
Phase diagrams : materials science and technology
Author 
Alper, Allan M., ed.
Preferred Shelf Number 
QD 501 P383 1970- V.1
Format: 
Availability 
Beytepe Library~3
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3. 
Cover image for Treatise on materials science and technology
Treatise on materials science and technology
Author 
Herman, Herbert
Preferred Shelf Number 
TA 403 H398 1972 V.1
Format: 
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4. 
Cover image for Composite Materials Science and Applications
Composite Materials Science and Applications
Author 
Chung, Deborah D.L. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84882-831-5
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5. 
Cover image for Materials Science with Ion Beams
Materials Science with Ion Beams
Author 
Bernas, Harry. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-88789-8
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6. 
Cover image for Essentials of materials science and engineering
Essentials of materials science and engineering
Author 
Askeland, Donald R. Fulay, Pradeep P., 1960-
Preferred Shelf Number 
TA403 A7335 2010
Format: 
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7. 
Cover image for Current topics in materials science
Current topics in materials science
Preferred Shelf Number 
TA 403 C87 1979 V.4
Format: 
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Beytepe Library~7
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8. 
Cover image for Materials science for electrical and electronic engineers
Materials science for electrical and electronic engineers
Author 
Jones, Ian P.
Preferred Shelf Number 
TK7871 J66 2010
Format: 
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9. 
Cover image for Advances in materials science for environmental and nuclear technology
Advances in materials science for environmental and nuclear technology
Author 
Fox, Kevin. American Ceramic Society. Materials Science & Technology Conference (2009 : Pittsburgh, Pa.)
Preferred Shelf Number 
ONLINE
Electronic Access 
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=624384
John Wiley http://dx.doi.org/10.1002/9780470930991
http://site.ebrary.com/lib/alltitles/Doc?id=10441428
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10. 
Cover image for Fatigue of materials and structures advances and emergencies in understanding, proceedings of a symposium held during Materials Science & Technology 2010 (MS&T'10) October 17-21, 2010 in Houston, Texas, USA
Fatigue of materials and structures advances and emergencies in understanding, proceedings of a symposium held during Materials Science & Technology 2010 (MS&T'10) October 17-21, 2010 in Houston, Texas, USA
Author 
Srivatsan, T. S. Imam, M. A. Wiley InterScience (Online service) Materials Science & Technology Conference (2010 : Houston, Texas)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781118013373
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11. 
Cover image for Recent advances in the science and technology of zeolites and related materials proceedings of the 14th International Zeolite Conference, Cape Town, South Africa, 25-30th April 2004
Recent advances in the science and technology of zeolites and related materials proceedings of the 14th International Zeolite Conference, Cape Town, South Africa, 25-30th April 2004
Author 
International Zeolite Conference (14th : 2004 : Cape Town, South Africa) Van Steen, E. (Eric) Callanan, L. H. (Linda H.) Claeys, C.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444518279
ScienceDirect http://www.sciencedirect.com/science/book/9780444518262
ScienceDirect http://www.sciencedirect.com/science/book/9780444518255
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12. 
Cover image for Advanced Materials Science & Technology in China: A Roadmap to 2050
Advanced Materials Science & Technology in China: A Roadmap to 2050
Author 
Lu, Ke. editor. Chen, Lidong. editor. He, Tianbai. editor. Yan, Qing. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-05318-4
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