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Cover image for Passive and Active Measurement 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings
Passive and Active Measurement 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings
Author 
Mirkovic, Jelena. editor. Liu, Yong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15509-8
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2. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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3. 
Cover image for Intelligence Science and Big Data Engineering. Image and Video Data Engineering 5th International Conference, IScIDE 2015, Suzhou, China, June 14-16, 2015, Revised Selected Papers, Part I
Intelligence Science and Big Data Engineering. Image and Video Data Engineering 5th International Conference, IScIDE 2015, Suzhou, China, June 14-16, 2015, Revised Selected Papers, Part I
Author 
He, Xiaofei. editor. Gao, Xinbo. editor. Zhang, Yanning. editor. Zhou, Zhi-Hua. editor. Liu, Zhi-Yong. editor.
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https://doi.org/10.1007/978-3-319-23989-7
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4. 
Cover image for Intelligence Science and Big Data Engineering. Big Data and Machine Learning Techniques 5th International Conference, IScIDE 2015, Suzhou, China, June 14-16, 2015, Revised Selected Papers, Part II
Intelligence Science and Big Data Engineering. Big Data and Machine Learning Techniques 5th International Conference, IScIDE 2015, Suzhou, China, June 14-16, 2015, Revised Selected Papers, Part II
Author 
He, Xiaofei. editor. Gao, Xinbo. editor. Zhang, Yanning. editor. Zhou, Zhi-Hua. editor. Liu, Zhi-Yong. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-23862-3
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