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1. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-72132-1
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2. 
Cover image for Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Author 
Wang, M. L., editor. Lynch, Jerome P. (Jerome Peter), editor. Sohn, H. (Hoon), editor.
Preferred Shelf Number 
ONLINE(355767.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781782422426
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3. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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4. 
Cover image for Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Author 
Zhu, Ren. author. Yang, Rusen. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-70038-0
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5. 
Cover image for Nanoscale Applications for Information and Energy Systems
Nanoscale Applications for Information and Energy Systems
Author 
Korkin, Anatoli. editor. Lockwood, David J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331649.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5016-0
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6. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
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ONLINE(331661.1)
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http://dx.doi.org/10.1007/978-1-4614-5052-8
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7. 
Cover image for Toward Quantum FinFET
Toward Quantum FinFET
Author 
Han, Weihua. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
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ONLINE(332897.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-02021-1
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8. 
Cover image for Fabrication of Complex Optical Components From Mold Design to Product
Fabrication of Complex Optical Components From Mold Design to Product
Author 
Brinksmeier, Ekkard. editor. Riemer, Oltmann. editor. Gläbe, Ralf M. editor. SpringerLink (Online service)
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ONLINE(333648.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-33001-8
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9. 
Cover image for Nanoimprint Lithography: An Enabling Process for Nanofabrication
Nanoimprint Lithography: An Enabling Process for Nanofabrication
Author 
Zhou, Weimin. author. SpringerLink (Online service)
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ONLINE(333849.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34428-2
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10. 
Cover image for Physical Properties of Nanorods
Physical Properties of Nanorods
Author 
Krahne, Roman. author. Manna, Liberato. author. Morello, Giovanni. author. Figuerola, Albert. author. George, Chandramohan. author.
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ONLINE(334202.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36430-3
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11. 
Cover image for High Permittivity Gate Dielectric Materials
High Permittivity Gate Dielectric Materials
Author 
Kar, Samares. editor. SpringerLink (Online service)
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ONLINE(334228.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36535-5
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12. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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