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1. 
Cover image for Nano-interconnect materials and models for next generation integrated circuit design
Nano-interconnect materials and models for next generation integrated circuit design
Author 
Bhattacharya, Sandip (Professor of electrical engineering), editor. J., Ajayan, editor. Herrera, Fernando Avila, editor.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003331650
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Low power designs in nanodevices and circuits for emerging applications
Low power designs in nanodevices and circuits for emerging applications
Author 
Birla, Shilpi, editor. Dargar, Shashi Kant, editor. Singh, Neha (Electronic engineering professor), editor. Sivakumar, P. (Pothiraj), editor.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003459231
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for Stress and strain engineering at nanoscale in semiconductor devices
Stress and strain engineering at nanoscale in semiconductor devices
Author 
Maiti, C. K., author.
Preferred Shelf Number 
TA405 .M35 2021
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003055723
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Cover image for INTRODUCTION TO MICROELECTRONICS TO NANOELECTRONICS design and technology.
INTRODUCTION TO MICROELECTRONICS TO NANOELECTRONICS design and technology.
Author 
Majumder, Manoj Kumar, author. Kumbhare, Vijay Rao, author. Japa, Aditya, author. Kaushik, Brajesh Kumar, author.
Preferred Shelf Number 
TK7874 .I58 2020
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003049203
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
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