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1. 
Cover image for Interconnect Technologies for Integrated Circuits and Flexible Electronics
Interconnect Technologies for Integrated Circuits and Flexible Electronics
Author 
Agrawal, Yash. editor. (orcid)0000-0001-9736-9581 Mummaneni, Kavicharan. editor. Sathyakam, P. Uma. editor. (orcid)0000-0002-6203-0956 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4476-7
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2. 
Cover image for Circular Array-Based Radio Frequency OAM Communications
Circular Array-Based Radio Frequency OAM Communications
Author 
Chen, Rui. author. Long, Wen-Xuan. author. Cheng, Nan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-37589-7
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3. 
Cover image for Transactions on Engineering Technologies World Congress on Engineering 2014
Transactions on Engineering Technologies World Congress on Engineering 2014
Author 
Yang, Gi-Chul. editor. Ao, Sio-Iong. editor. Gelman, Len. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9804-4
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