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1. 
Cover image for Heat Transfer Modeling An Inductive Approach
Heat Transfer Modeling An Inductive Approach
Author 
Sidebotham, George. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-14514-3
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2. 
Cover image for Imaging Heat and Mass Transfer Processes Visualization and Analysis
Imaging Heat and Mass Transfer Processes Visualization and Analysis
Author 
Panigrahi, Pradipta Kumar. author. Muralidhar, Krishnamurthy. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331588.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4791-7
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3. 
Cover image for Introduction to Computational Mass Transfer With Applications to Chemical Engineering
Introduction to Computational Mass Transfer With Applications to Chemical Engineering
Author 
Yu, Kuo-Tsung. author. Yuan, Xigang. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-2498-6
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4. 
Cover image for Introduction to Computational Mass Transfer With Applications to Chemical Engineering
Introduction to Computational Mass Transfer With Applications to Chemical Engineering
Author 
Yu, Kuo-Tsong. author. Yuan, Xigang. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-53911-4
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5. 
Cover image for Proceedings of the 5th International Conference on Numerical Modelling in Engineering Volume 1: Numerical Modelling in Civil Engineering, NME 2022, 23-24 August, Ghent University, Belgium
Proceedings of the 5th International Conference on Numerical Modelling in Engineering Volume 1: Numerical Modelling in Civil Engineering, NME 2022, 23-24 August, Ghent University, Belgium
Author 
Abdel Wahab, Magd. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8429-7
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6. 
Cover image for 3rd International Conference on Thermal Issues in Machine Tools (ICTIMT2023)
3rd International Conference on Thermal Issues in Machine Tools (ICTIMT2023)
Author 
Ihlenfeldt, Steffen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-34486-2
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7. 
Cover image for Computer models of process dynamics : from Newton to energy fields
Computer models of process dynamics : from Newton to energy fields
Author 
Rubin, Olis, author.
Preferred Shelf Number 
QC52 .R83 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119885689
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8. 
Cover image for Tunnel Fire Testing and Modeling The Morgex North Tunnel Experiment
Tunnel Fire Testing and Modeling The Morgex North Tunnel Experiment
Author 
Borghetti, Fabio. author. Derudi, Marco. author. Gandini, Paolo. author. Frassoldati, Alessio. author. Tavelli, Silvia. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49517-0
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9. 
Cover image for Thermo-Hydro-Mechanical-Chemical Processes in Fractured Porous Media: Modelling and Benchmarking Benchmarking Initiatives
Thermo-Hydro-Mechanical-Chemical Processes in Fractured Porous Media: Modelling and Benchmarking Benchmarking Initiatives
Author 
Kolditz, Olaf. editor. (orcid)0000-0002-8098-4905 Görke, Uwe-Jens. editor. Shao, Hua. editor. Wang, Wenqing. editor. Bauer, Sebastian. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-29224-3
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10. 
Cover image for Unsteady Turbulent Flow Modelling and Applications
Unsteady Turbulent Flow Modelling and Applications
Author 
Roos Launchbury, David. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-658-11912-6
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11. 
Cover image for Mathematical Modeling of Disperse Two-Phase Flows
Mathematical Modeling of Disperse Two-Phase Flows
Author 
Morel, Christophe. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-20104-7
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12. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2581-0
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