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1. 
Cover image for Microfluidic Very Large Scale Integration (VLSI) Modeling, Simulation, Testing, Compilation and Physical Synthesis
Microfluidic Very Large Scale Integration (VLSI) Modeling, Simulation, Testing, Compilation and Physical Synthesis
Author 
Pop, Paul. author. Minhass, Wajid Hassan. author. Madsen, Jan. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-29599-2
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2. 
Cover image for Single-Event Effects, from Space to Accelerator Environments Analysis, Prediction and Hardening by Design
Single-Event Effects, from Space to Accelerator Environments Analysis, Prediction and Hardening by Design
Author 
Aguiar, Ygor Quadros de. author. (orcid)0000-0003-4416-2610 Wrobel, Frédéric. author. Autran, Jean-Luc. author. García Alía, Rubén. author. (orcid)0000-0003-4416-2610 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71723-9
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3. 
Cover image for Performance Engineering Learning Through Applications Using JMT
Performance Engineering Learning Through Applications Using JMT
Author 
Serazzi, Giuseppe. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-36763-2
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4. 
Cover image for Structural Decision Diagrams in Digital Test Theory and Applications
Structural Decision Diagrams in Digital Test Theory and Applications
Author 
Ubar, Raimund. author. Raik, Jaan. author. Jenihhin, Maksim. author. Jutman, Artur. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-44734-1
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5. 
Cover image for Proceedings of 2023 11th China Conference on Command and Control
Proceedings of 2023 11th China Conference on Command and Control
Author 
SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-9021-4
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6. 
Cover image for Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Author 
Pietrenko-Dabrowska, Anna. author. Koziel, Slawomir. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-43845-5
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7. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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8. 
Cover image for Model-Implementation Fidelity in Cyber Physical System Design
Model-Implementation Fidelity in Cyber Physical System Design
Author 
Molnos, Anca. editor. Fabre, Christian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-47307-9
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9. 
Cover image for Carbon Nanotubes for Interconnects Process, Design and Applications
Carbon Nanotubes for Interconnects Process, Design and Applications
Author 
Todri-Sanial, Aida. editor. Dijon, Jean. editor. Maffucci, Antonio. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29746-0
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10. 
Cover image for Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2014
Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2014
Author 
Oppenheimer, Frank. editor. Medina Pasaje, Julio Luis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-24457-0
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11. 
Cover image for Smart Systems Integration and Simulation
Smart Systems Integration and Simulation
Author 
Bombieri, Nicola. editor. Poncino, Massimo. editor. Pravadelli, Graziano. editor. (orcid)0000-0002-7833-1673 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-27392-1
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12. 
Cover image for SystemVerilog Assertions and Functional Coverage Guide to Language, Methodology and Applications
SystemVerilog Assertions and Functional Coverage Guide to Language, Methodology and Applications
Author 
Mehta, Ashok B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-30539-4
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