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1. 
Cover image for Fundamentals of Electronic Systems Design
Fundamentals of Electronic Systems Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Bruemmer, Hans. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-55840-0
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2. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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4. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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