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1. 
Cover image for Bias Temperature Instability for Devices and Circuits
Bias Temperature Instability for Devices and Circuits
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4614-7909-3
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2. 
Cover image for Willemite-Based Glass Ceramic Doped by Different Percentage of Erbium Oxide and Sintered in Temperature of 500-1100C Physical and Optical Properties
Willemite-Based Glass Ceramic Doped by Different Percentage of Erbium Oxide and Sintered in Temperature of 500-1100C Physical and Optical Properties
Author 
Sarrigani, Gholamreza Vahedi. author. Amiri, Iraj Sadegh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-10644-7
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3. 
Cover image for Fundamentals of Bias Temperature Instability in MOS Transistors Characterization Methods, Process and Materials Impact, DC and AC Modeling
Fundamentals of Bias Temperature Instability in MOS Transistors Characterization Methods, Process and Materials Impact, DC and AC Modeling
Author 
Mahapatra, Souvik. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2508-9
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4. 
Cover image for Temperature- and Supply Voltage-Independent Time References for Wireless Sensor Networks
Temperature- and Supply Voltage-Independent Time References for Wireless Sensor Networks
Author 
De Smedt, Valentijn. author. Gielen, Georges. author. Dehaene, Wim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09003-0
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5. 
Cover image for Advances in VLSI and Embedded Systems Select Proceedings of AVES 2021
Advances in VLSI and Embedded Systems Select Proceedings of AVES 2021
Author 
Darji, Anand D. editor. Joshi, Deepak. editor. Joshi, Amit. editor. Sheriff, Ray. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-6780-1
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6. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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7. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-28912-5
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8. 
Cover image for High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
Author 
Abbene, Leonardo. editor. Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20955-0
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9. 
Cover image for Sensors and Microsystems Proceedings of AISEM 2022
Sensors and Microsystems Proceedings of AISEM 2022
Author 
Di Francia, Girolamo. editor. Di Natale, Corrado. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-25706-3
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10. 
Cover image for Differentiated Layout Styles for MOSFETs Electrical Behavior in Harsh Environments
Differentiated Layout Styles for MOSFETs Electrical Behavior in Harsh Environments
Author 
Gimenez, Salvador Pinillos. author. Galembeck, Egon Henrique Salerno. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29086-2
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11. 
Cover image for Model-Implementation Fidelity in Cyber Physical System Design
Model-Implementation Fidelity in Cyber Physical System Design
Author 
Molnos, Anca. editor. Fabre, Christian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-47307-9
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12. 
Cover image for Inverter-Based Circuit Design Techniques for Low Supply Voltages
Inverter-Based Circuit Design Techniques for Low Supply Voltages
Author 
Palani, Rakesh Kumar. author. Harjani, Ramesh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-46628-6
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