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1. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
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2. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
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3. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
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4. 
Cover image for Electronic packaging science and technology
Electronic packaging science and technology
Author 
Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.
Preferred Shelf Number 
TK7870.15 .T85 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
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5. 
Cover image for Recent Trends in VLSI and Semiconductor Packaging
Recent Trends in VLSI and Semiconductor Packaging
Author 
Vasudeva Reddy, T., editor. Madhava Rao, K., editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003616399
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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7. 
Cover image for PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
Author 
JAMNIA, ALI.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Cover image for Thermal and structural electronic packaging analysis for space and extreme environments
Thermal and structural electronic packaging analysis for space and extreme environments
Author 
Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
Preferred Shelf Number 
ONLINE
Electronic Access 
Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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10. 
Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK7870.15 .J36 2009
Electronic Access 
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11. 
Cover image for Lead-free soldering process development and reliability
Lead-free soldering process development and reliability
Author 
Bath, Jasbir, editor.
Preferred Shelf Number 
TK7870.15 .L434 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093
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12. 
Cover image for Electronic enclosures, housings and packages
Electronic enclosures, housings and packages
Author 
Süli, Frank, author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081023914
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