Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
8 Results Found Subscribe to search results
00000000DEFAULT
Print
1. 
Cover image for Reliability of CMOS Analog ICs
Reliability of CMOS Analog ICs
Author 
Kuntman, Hakan. author. Özenli, Deniz. author. (orcid)0000-0002-6381-3629 Kaçar, Fırat. author. (orcid)0000-0002-0967-914X Özçelep, Yasin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-85455-2
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Lifetime Reliability-aware Design of Integrated Circuits
Lifetime Reliability-aware Design of Integrated Circuits
Author 
Raji, Mohsen. author. Ghavami, Behnam. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-15345-7
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Author 
van Driel, Willem Dirk. editor. Pressel, Klaus. editor. Soyturk, Mujdat. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59361-1
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for CMOS Plasma and Process Damage
CMOS Plasma and Process Damage
Author 
Prall, Kirk. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-89029-1
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Quantum Computing Circuits, Systems, Automation and Applications
Quantum Computing Circuits, Systems, Automation and Applications
Author 
Thapliyal, Himanshu. editor. Humble, Travis. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-37966-6
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for GaN Technology Materials, Manufacturing, Devices and Design for Power Conversion
GaN Technology Materials, Manufacturing, Devices and Design for Power Conversion
Author 
Di Paolo Emilio, Maurizio. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-63238-9
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for SiC Technology Materials, Manufacturing, Devices and Design for Power Conversion
SiC Technology Materials, Manufacturing, Devices and Design for Power Conversion
Author 
Di Paolo Emilio, Maurizio. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-63418-5
Format: 
Availability 
Online Library~1
Available:
Copies: