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1. 
Cover image for Emerging Smart Technologies for Critical Infrastructure
Emerging Smart Technologies for Critical Infrastructure
Author 
Pal, Shantanu. editor. Jadidi, Zahra. editor. Foo, Ernest. editor. Mukhopadhyay, Subhas C. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29845-5
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2. 
Cover image for MATERIALS FROM NATURAL SOURCES : structure, properties, and applications
MATERIALS FROM NATURAL SOURCES : structure, properties, and applications
Author 
Gardas, Ramesh.
Preferred Shelf Number 
TA403.6
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781032636368
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for HIGH-ENTROPY MATERIALS : advances and applications.
HIGH-ENTROPY MATERIALS : advances and applications.
Author 
ZHANG, YONG.
Preferred Shelf Number 
QC318 .E57
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003319986
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Cover image for Soft Matter under Exogenic Impacts
Soft Matter under Exogenic Impacts
Author 
Rzoska, Sylwester J. editor. Mazur, Victor A. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-5872-1
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5. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Author 
Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0055-8
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