Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
4 Results Found Subscribe to search results
0000DEFAULT
Print
1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Microengineering, MEMS, and interfacing : a practical guide
Microengineering, MEMS, and interfacing : a practical guide
Author 
Banks, Danny., author.
Preferred Shelf Number 
TK7875 .B36 2006
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for MEMS and Microstructures in aerospace applications
MEMS and Microstructures in aerospace applications
Author 
Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.
Preferred Shelf Number 
TL589 .O85 2006
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies: