Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
4 Results Found Subscribe to search results
0000DEFAULT
Print
1. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Author 
Keser, Beth, 1971- editor. Kröhnert, Steffen, editor.
Preferred Shelf Number 
TK7870.15 .E43 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
Format: 
Availability 
Online Library~1
Available:
Copies: