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1. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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2. 
Cover image for Frontiers in Electronic Technologies Trends and Challenges
Frontiers in Electronic Technologies Trends and Challenges
Author 
Prabaharan, S.R.S. editor. Thalmann, Nadia Magnenat. editor. (orcid)0000-0002-1459-5960 Kanchana Bhaaskaran, V. S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4235-5
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3. 
Cover image for Implantable Medical Electronics Prosthetics, Drug Delivery, and Health Monitoring
Implantable Medical Electronics Prosthetics, Drug Delivery, and Health Monitoring
Author 
Khanna, Vinod Kumar. author. (orcid)0000-0001-7536-4798 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-25448-7
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4. 
Cover image for Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Author 
Vourkas, Ioannis. author. Sirakoulis, Georgios Ch. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-22647-7
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