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1. 
Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
Author 
Wang, Kaiying. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-95-1606-3
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2. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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3. 
Cover image for Comparators in Nanometer CMOS Technology
Comparators in Nanometer CMOS Technology
Author 
Goll, Bernhard. author. Zimmermann, Horst. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44482-5
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4. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
Author 
Jackson, Mark J. editor. (orcid)0000-0001-9087-3515 Ahmed, Waqar. editor. (orcid)0000-0003-4152-5172 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-70499-4
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5. 
Cover image for Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Author 
Pachkawade, Vinayak. editor. Guha, Koushik. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4659-3
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6. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Author 
Guha, Koushik. editor. Saha, Samar Kanti. editor. (orcid)0000-0002-5687-591X Iannacci, Jacopo. editor. (orcid)0000-0001-6462-4814 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-3758-4
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7. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Author 
Lenka, Trupti Ranjan. editor. (orcid)0000-0002-8002-3901 Saha, Samar K. editor. (orcid)0000-0002-5687-591X Fu, Lan. editor. (orcid)0000-0002-9070-8373 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4495-8
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8. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62546-6
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9. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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10. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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11. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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12. 
Cover image for Piezoelectric MEMS Resonators
Piezoelectric MEMS Resonators
Author 
Bhugra, Harmeet. editor. Piazza, Gianluca. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-28688-4
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