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1. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-84882-507-9
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2. 
Cover image for Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Author 
Meneghesso, Gaudenzio. editor. Meneghini, Matteo. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-77994-2
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3. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
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http://dx.doi.org/10.1007/978-1-4614-3160-2
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4. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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5. 
Cover image for Organic Field Effect Transistors Theory, Fabrication and Characterization
Organic Field Effect Transistors Theory, Fabrication and Characterization
Author 
Kymissis, Ioannis. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-92134-1
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6. 
Cover image for Carbon Nanotube Electronics
Carbon Nanotube Electronics
Author 
Kong, Jing. editor. Javey, Ali. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-69285-2
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7. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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8. 
Cover image for Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Author 
Valle, Maurizio. editor. (orcid)0000-0002-7366-6060 Gastaldo, Paolo. editor. (orcid)0000-0002-5748-3942 Limiti, Ernesto. editor. (orcid)0000-0003-4668-7461 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71518-1
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9. 
Cover image for Active Metamaterials Terahertz Modulators and Detectors
Active Metamaterials Terahertz Modulators and Detectors
Author 
Rout, Saroj. author. Sonkusale, Sameer. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52219-7
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10. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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11. 
Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Author 
Askerzade, Iman. author. Bozbey, Ali. author. Cantürk, Mehmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-48433-4
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12. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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