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1. 
Cover image for Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Author 
Valle, Maurizio. editor. (orcid)0000-0002-7366-6060 Gastaldo, Paolo. editor. (orcid)0000-0002-5748-3942 Limiti, Ernesto. editor. (orcid)0000-0003-4668-7461 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71518-1
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2. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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3. 
Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Author 
Askerzade, Iman. author. Bozbey, Ali. author. Cantürk, Mehmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-48433-4
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4. 
Cover image for Piezoelectric MEMS Resonators
Piezoelectric MEMS Resonators
Author 
Bhugra, Harmeet. editor. Piazza, Gianluca. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-28688-4
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5. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-43199-4
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6. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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7. 
Cover image for Fracture Mechanics of Piezoelectric Solids with Interface Cracks
Fracture Mechanics of Piezoelectric Solids with Interface Cracks
Author 
Govorukha, Volodymyr. author. Kamlah, Marc. author. Loboda, Volodymyr. author. Lapusta, Yuri. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-53553-1
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8. 
Cover image for Nanoporous Metals for Advanced Energy Technologies
Nanoporous Metals for Advanced Energy Technologies
Author 
Ding, Yi. author. Zhang, Zhonghua. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29749-1
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9. 
Cover image for Handbook of Visual Display Technology
Handbook of Visual Display Technology
Author 
Chen, Janglin. editor. Cranton, Wayne. editor. Fihn, Mark. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-14346-0
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10. 
Cover image for Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Author 
Peng, Hua-Xin. author. Qin, Faxiang. author. Phan, Manh-Huong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29276-2
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11. 
Cover image for Elements of Plasma Technology
Elements of Plasma Technology
Author 
Wong, Chiow San. author. Mongkolnavin, Rattachat. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-0117-8
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12. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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