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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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2. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02417-7
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3. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72132-1
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4. 
Cover image for Mercury cadmium telluride growth, properties, and applications
Mercury cadmium telluride growth, properties, and applications
Author 
Capper, Peter. Garland, James, 1933-
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ONLINE(318951.1)
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5. 
Cover image for Ultrathin Metal Transparent Electrodes for the Optoelectronics Industry
Ultrathin Metal Transparent Electrodes for the Optoelectronics Industry
Author 
Ghosh, Dhriti Sundar. author. SpringerLink (Online service)
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ONLINE(332727.1)
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http://dx.doi.org/10.1007/978-3-319-00348-1
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6. 
Cover image for Optical Absorption of Impurities and Defects in Semiconducting Crystals Electronic Absorption of Deep Centres and Vibrational Spectra
Optical Absorption of Impurities and Defects in Semiconducting Crystals Electronic Absorption of Deep Centres and Vibrational Spectra
Author 
Pajot, Bernard. author. Clerjaud, Bernard. author. SpringerLink (Online service)
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ONLINE(333081.1)
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http://dx.doi.org/10.1007/978-3-642-18018-7
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7. 
Cover image for Energy Level Alignment and Electron Transport Through Metal/Organic Contacts From Interfaces to Molecular Electronics
Energy Level Alignment and Electron Transport Through Metal/Organic Contacts From Interfaces to Molecular Electronics
Author 
Abad, Enrique. author. SpringerLink (Online service)
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ONLINE(333371.1)
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http://dx.doi.org/10.1007/978-3-642-30907-6
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8. 
Cover image for VCSELs Fundamentals, Technology and Applications of Vertical-Cavity Surface-Emitting Lasers
VCSELs Fundamentals, Technology and Applications of Vertical-Cavity Surface-Emitting Lasers
Author 
Michalzik, Rainer. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-24986-0
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9. 
Cover image for Mechanics of Advanced Functional Materials
Mechanics of Advanced Functional Materials
Author 
Wang, Biao. author. SpringerLink (Online service)
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ONLINE(333728.1)
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http://dx.doi.org/10.1007/978-3-642-33596-9
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10. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
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ONLINE(331478.1)
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http://dx.doi.org/10.1007/978-1-4614-4337-7
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11. 
Cover image for Toward Quantum FinFET
Toward Quantum FinFET
Author 
Han, Weihua. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
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ONLINE(332897.1)
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http://dx.doi.org/10.1007/978-3-319-02021-1
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12. 
Cover image for GaP Heteroepitaxy on Si(100) Benchmarking Surface Signals when Growing GaP on Si in CVD Ambients
GaP Heteroepitaxy on Si(100) Benchmarking Surface Signals when Growing GaP on Si in CVD Ambients
Author 
Döscher, Henning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-319-02880-4
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