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Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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2. 
Cover image for Proceedings of the 4th Annual International Conference on Material, Machines, and Methods for Sustainable Development (MMMS2024) Volume 1: Advanced Materials and Manufacturing Technologies
Proceedings of the 4th Annual International Conference on Material, Machines, and Methods for Sustainable Development (MMMS2024) Volume 1: Advanced Materials and Manufacturing Technologies
Author 
Long, Banh Tien. editor. Nang, Ho Xuan. editor. Huy, Pham Thanh. editor. Kim, Yun-Hae. editor. Ishizaki, Kozo. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-93816-0
Format: 
Availability 
Online Library~1
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