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2024-08-25T07:45:45Z
Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
ent://SD_ILS/0/SD_ILS:400686
2024-08-25T07:45:45Z
2024-08-25T07:45:45Z
Author Han, Yafang. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-13-0107-0">https://doi.org/10.1007/978-981-13-0107-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
ent://SD_ILS/0/SD_ILS:400941
2024-08-25T07:45:45Z
2024-08-25T07:45:45Z
Author Seok, Seonho. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
ent://SD_ILS/0/SD_ILS:401399
2024-08-25T07:45:45Z
2024-08-25T07:45:45Z
Author Cheng, Jie. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-10-6165-3">https://doi.org/10.1007/978-981-10-6165-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Laser Metal Deposition Process of Metals, Alloys, and Composite Materials
ent://SD_ILS/0/SD_ILS:401419
2024-08-25T07:45:45Z
2024-08-25T07:45:45Z
Author Mahamood, Rasheedat Modupe. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-64985-6">https://doi.org/10.1007/978-3-319-64985-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>