Search Results for - Narrowed by: Wong, C.P. editor.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qf$003dAUTHOR$002509Author$002509Wong$00252C$002bC.P.$002beditor.$002509Wong$00252C$002bC.P.$002beditor.$0026ps$003d300$0026isd$003dtrue?
2024-09-13T18:07:49Z
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
2024-09-13T18:07:49Z
2024-09-13T18:07:49Z
Author Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(330808.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Nano-Bio- Electronic, Photonic and MEMS Packaging
ent://SD_ILS/0/SD_ILS:171848
2024-09-13T18:07:49Z
2024-09-13T18:07:49Z
Author Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:167565
2024-09-13T18:07:49Z
2024-09-13T18:07:49Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>