Search Results for -- ANSİKLOPEDİLER. - Narrowed by: Electronics. - Engineering. - Surfaces (Physics).
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003d--$002bANS$0025C4$0025B0KLOPED$0025C4$0025B0LER.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026qf$003dSUBJECT$002509Subject$002509Engineering.$002509Engineering.$0026qf$003dSUBJECT$002509Subject$002509Surfaces$002b$002528Physics$002529.$002509Surfaces$002b$002528Physics$002529.$0026te$003dILS$0026ps$003d300$0026isd$003dtrue?dt=list
2024-08-11T00:25:03Z
MEMS Materials and Processes Handbook
ent://SD_ILS/0/SD_ILS:166368
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-47318-5">http://dx.doi.org/10.1007/978-0-387-47318-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ent://SD_ILS/0/SD_ILS:168463
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Introductory MEMS Fabrication and Applications
ent://SD_ILS/0/SD_ILS:164671
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Adams, Thomas M. author. Layton, Richard A. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-09511-0">http://dx.doi.org/10.1007/978-0-387-09511-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
ent://SD_ILS/0/SD_ILS:172064
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-0784-4">http://dx.doi.org/10.1007/978-1-4419-0784-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Sapphire Material, Manufacturing, Applications
ent://SD_ILS/0/SD_ILS:167789
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-85695-7">http://dx.doi.org/10.1007/978-0-387-85695-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Wafer Level 3-D ICs Process Technology
ent://SD_ILS/0/SD_ILS:167360
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-76534-1">http://dx.doi.org/10.1007/978-0-387-76534-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
ent://SD_ILS/0/SD_ILS:165572
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-28843-0">http://dx.doi.org/10.1007/0-387-28843-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Materials for Information Technology Devices, Interconnects and Packaging
ent://SD_ILS/0/SD_ILS:175333
2024-08-11T00:25:03Z
2024-08-11T00:25:03Z
Author Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/1-84628-235-7">http://dx.doi.org/10.1007/1-84628-235-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>