Search Results for Aerospace engineering. - Narrowed by: Electronic packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dAerospace$002bengineering.$0026qf$003dSUBJECT$002509Subject$002509Electronic$002bpackaging.$002509Electronic$002bpackaging.$0026ps$003d300?dt=list
2026-01-15T23:41:35Z
Thermal and structural electronic packaging analysis for space and extreme environments
ent://SD_ILS/0/SD_ILS:579090
2026-01-15T23:41:35Z
2026-01-15T23:41:35Z
Author Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.<br/>Preferred Shelf Number TK7870.15<br/>Electronic Access Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003247005">https://www.taylorfrancis.com/books/9781003247005</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
MEMS Packaging
ent://SD_ILS/0/SD_ILS:247779
2026-01-15T23:41:35Z
2026-01-15T23:41:35Z
Author Tai-Ran Hsu, ed.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP003E">http://dx.doi.org/10.1049/PBEP003E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>