Search Results for Bonding. - Narrowed by: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dBonding.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-03-24T14:49:59Z
Bonding in Microsystem Technology
ent://SD_ILS/0/SD_ILS:169225
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Dziuban, Jan A. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/1-4020-4589-1">http://dx.doi.org/10.1007/1-4020-4589-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
ent://SD_ILS/0/SD_ILS:608515
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-96-4166-6">https://doi.org/10.1007/978-981-96-4166-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
ent://SD_ILS/0/SD_ILS:603646
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Lau, John H. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-97-2140-5">https://doi.org/10.1007/978-981-97-2140-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Lau, John H. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
The ESD control program handbook
ent://SD_ILS/0/SD_ILS:595961
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Smallwood, J. M. (Jeremy M.), author.<br/>Preferred Shelf Number TK7870<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781118694541">https://onlinelibrary.wiley.com/doi/book/10.1002/9781118694541</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Flat panel display manufacturing
ent://SD_ILS/0/SD_ILS:594637
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Souk, Jun, editor. Morozumi, Shinji, editor. Luo, Fang-Chen, editor. Bita, Ion, editor.<br/>Preferred Shelf Number TK7882 .I6 F53 2018<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119161387">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119161387</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
ent://SD_ILS/0/SD_ILS:593495
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Li, Suny, 1974- author.<br/>Preferred Shelf Number TK7874<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D Microelectronic Packaging From Fundamentals to Applications
ent://SD_ILS/0/SD_ILS:613043
2026-03-24T14:49:59Z
2026-03-24T14:49:59Z
Author Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>