Search Results for Bonding. - Narrowed by: Mechatronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dBonding.$0026qf$003dSUBJECT$002509Subject$002509Mechatronics.$002509Mechatronics.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-04-04T11:53:52Z
Copper Wire Bonding
ent://SD_ILS/0/SD_ILS:484702
2026-04-04T11:53:52Z
2026-04-04T11:53:52Z
Author Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4614-5761-9">https://doi.org/10.1007/978-1-4614-5761-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Microactuators, Microsensors and Micromechanisms MAMM 2024
ent://SD_ILS/0/SD_ILS:607579
2026-04-04T11:53:52Z
2026-04-04T11:53:52Z
Author Nguyen, Duc-Nam. editor. Tran, Ngoc Dang Khoa. editor. (orcid)0000-0002-5779-2016 Huynh, Van Tuan. editor. Ono, Takahito. editor. Nguyen, Van Hieu. editor.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-031-83357-1">https://doi.org/10.1007/978-3-031-83357-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>