Search Results for Bonding. - Narrowed by: Micromechanics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dBonding.$0026qf$003dSUBJECT$002509Subject$002509Micromechanics.$002509Micromechanics.$0026ps$003d300$0026isd$003dtrue?dt=list
2024-11-24T13:05:40Z
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
ent://SD_ILS/0/SD_ILS:247777
2024-11-24T13:05:40Z
2024-11-24T13:05:40Z
Author Iyer, S. S., ed. Auberton-Herv�, A. J., e<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP001E">http://dx.doi.org/10.1049/PBEP001E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
MEMS Packaging
ent://SD_ILS/0/SD_ILS:247779
2024-11-24T13:05:40Z
2024-11-24T13:05:40Z
Author Tai-Ran Hsu, ed.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP003E">http://dx.doi.org/10.1049/PBEP003E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>