Search Results for Chip scale packaging. - Narrowed by: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dChip$002bscale$002bpackaging.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ps$003d300?dt=list
2026-03-20T13:49:38Z
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2026-03-20T13:49:38Z
2026-03-20T13:49:38Z
Author Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advances in embedded and fan-out wafer level packaging technologies
ent://SD_ILS/0/SD_ILS:594706
2026-03-20T13:49:38Z
2026-03-20T13:49:38Z
Author Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.<br/>Preferred Shelf Number TK7870.17 .A38 2019<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-03-20T13:49:38Z
2026-03-20T13:49:38Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>