Search Results for Chip scale packaging. - Narrowed by: Microelectromechanical systems.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dChip$002bscale$002bpackaging.$0026qf$003dSUBJECT$002509Subject$002509Microelectromechanical$002bsystems.$002509Microelectromechanical$002bsystems.$0026ps$003d300?dt=list
2026-03-20T15:50:01Z
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-03-20T15:50:01Z
2026-03-20T15:50:01Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
MEMS/MOEMS packaging concepts, designs, materials, and processes
ent://SD_ILS/0/SD_ILS:293599
2026-03-20T15:50:01Z
2026-03-20T15:50:01Z
Author Gilleo, Ken.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>