Search Results for Circuits and Systems. - Narrowed by: Bonding.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dCircuits$002band$002bSystems.$0026qf$003dSUBJECT$002509Subject$002509Bonding.$002509Bonding.$0026te$003dILS$0026ps$003d300?dt=list
2025-01-03T17:14:35Z
MEMS Packaging
ent://SD_ILS/0/SD_ILS:247779
2025-01-03T17:14:35Z
2025-01-03T17:14:35Z
Author Tai-Ran Hsu, ed.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP003E">http://dx.doi.org/10.1049/PBEP003E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
ent://SD_ILS/0/SD_ILS:247777
2025-01-03T17:14:35Z
2025-01-03T17:14:35Z
Author Iyer, S. S., ed. Auberton-Herv�, A. J., e<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP001E">http://dx.doi.org/10.1049/PBEP001E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>