Search Results for Electronic packaging. - Narrowed by: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dElectronic$002bpackaging.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-03-20T15:59:52Z
Polymeric materials for electronic packaging
ent://SD_ILS/0/SD_ILS:598478
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Author Nakamura, Shozo (Professor Emeritus), author.<br/>Preferred Shelf Number QD382 .C66 N35 2023<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826">https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Nano-Bio- Electronic, Photonic and MEMS Packaging
ent://SD_ILS/0/SD_ILS:171848
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Author Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
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Author Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced Materials for Thermal Management of Electronic Packaging
ent://SD_ILS/0/SD_ILS:172970
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Author Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
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Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Sensing technologies for real time monitoring of water quality
ent://SD_ILS/0/SD_ILS:598351
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Author Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.<br/>Preferred Shelf Number TD367 .M3175 2023<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
ent://SD_ILS/0/SD_ILS:596092
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Author Domingo, George, 1937- author.<br/>Preferred Shelf Number TK7871.85 .D66 2020<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advances in embedded and fan-out wafer level packaging technologies
ent://SD_ILS/0/SD_ILS:594706
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Author Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.<br/>Preferred Shelf Number TK7870.17 .A38 2019<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
RF and Microwave Microelectronics Packaging II
ent://SD_ILS/0/SD_ILS:616783
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Author Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-51697-4">https://doi.org/10.1007/978-3-319-51697-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D Microelectronic Packaging From Fundamentals to Applications
ent://SD_ILS/0/SD_ILS:613043
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Author Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
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Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>