Search Results for Electronic packaging. - Narrowed by: Engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dElectronic$002bpackaging.$0026qf$003dSUBJECT$002509Subject$002509Engineering.$002509Engineering.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-01-16T23:55:03Z
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2026-01-16T23:55:03Z
2026-01-16T23:55:03Z
Author Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced Materials for Thermal Management of Electronic Packaging
ent://SD_ILS/0/SD_ILS:172970
2026-01-16T23:55:03Z
2026-01-16T23:55:03Z
Author Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2026-01-16T23:55:03Z
2026-01-16T23:55:03Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>