Search Results for Grinding and polishing. - Narrowed by: Chemical mechanical planarization.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dGrinding$002band$002bpolishing.$0026qf$003dSUBJECT$002509Subject$002509Chemical$002bmechanical$002bplanarization.$002509Chemical$002bmechanical$002bplanarization.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?dt=list2024-06-30T03:54:08ZTribology in chemical-mechanical planarizationent://SD_ILS/0/SD_ILS:2884892024-06-30T03:54:08Z2024-06-30T03:54:08ZAuthor Liang, Hong, 1961- Craven, David R., 1945-<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://marc.crcnetbase.com/isbn/9781420028393">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Chemical mechanical planarization of microelectronic materialsent://SD_ILS/0/SD_ILS:3008162024-06-30T03:54:08Z2024-06-30T03:54:08ZAuthor Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access John Wiley <a href="http://dx.doi.org/10.1002/9783527617746">http://dx.doi.org/10.1002/9783527617746</a>
Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley041/96006198.html">http://catdir.loc.gov/catdir/bios/wiley041/96006198.html</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>