Search Results for Heat transfer. - Narrowed by: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dHeat$002btransfer.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ps$003d300?
2025-12-30T20:52:16Z
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2025-12-30T20:52:16Z
2025-12-30T20:52:16Z
Author Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Thermal Transport in Oblique Finned Micro/Minichannels
ent://SD_ILS/0/SD_ILS:530267
2025-12-30T20:52:16Z
2025-12-30T20:52:16Z
Author Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-09647-6">https://doi.org/10.1007/978-3-319-09647-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced Thermal Management Materials
ent://SD_ILS/0/SD_ILS:331292
2025-12-30T20:52:16Z
2025-12-30T20:52:16Z
Author Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(331292.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4614-1963-1">http://dx.doi.org/10.1007/978-1-4614-1963-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>