Search Results for Integrated circuits. - Narrowed by: Three-dimensional integrated circuits. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dIntegrated$002bcircuits.$0026qf$003dSUBJECT$002509Subject$002509Three-dimensional$002bintegrated$002bcircuits.$002509Three-dimensional$002bintegrated$002bcircuits.$0026ps$003d300? 2025-12-13T10:07:17Z Design of 3D integrated circuits and systems ent://SD_ILS/0/SD_ILS:541456 2025-12-13T10:07:17Z 2025-12-13T10:07:17Z Author&#160;Sharma, Rohit, editor.<br/>Preferred Shelf Number&#160;TK7874.893 .D48 2014<br/>Electronic Access&#160;<a href="https://www.taylorfrancis.com/books/9781466589421">Click here to view.</a><br/>Format:&#160;Books<br/>Availability&#160;Online Library~1<br/> Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC ent://SD_ILS/0/SD_ILS:249361 2025-12-13T10:07:17Z 2025-12-13T10:07:17Z Author&#160;Li, Er-Ping.&#160;Wiley InterScience (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;IEEEXplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC ent://SD_ILS/0/SD_ILS:269867 2025-12-13T10:07:17Z 2025-12-13T10:07:17Z Author&#160;Li, Er-Ping.<br/>Preferred Shelf Number&#160;TK7874.893 L53 2012<br/>Format:&#160;Books<br/>Availability&#160;Beytepe Library~1<br/> Vertical 3D memory technologies ent://SD_ILS/0/SD_ILS:341730 2025-12-13T10:07:17Z 2025-12-13T10:07:17Z Author&#160;Prince, Betty, author.<br/>Preferred Shelf Number&#160;ONLINE(341730.1)<br/>Electronic Access&#160;ebrary <a href="http://alltitles.ebrary.com/Doc?id=10899788">An electronic book accessible through the World Wide Web; click to view</a> John Wiley <a href="http://dx.doi.org/10.1002/9781118760475">http://dx.doi.org/10.1002/9781118760475</a> Safari Books Online <a href="http://proquest.safaribooksonline.com/?fpi=9781118760468">http://proquest.safaribooksonline.com/?fpi=9781118760468</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Through-silicon vias for 3D integration ent://SD_ILS/0/SD_ILS:293478 2025-12-13T10:07:17Z 2025-12-13T10:07:17Z Author&#160;Lau, John.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> 3D IC stacking technology ent://SD_ILS/0/SD_ILS:293493 2025-12-13T10:07:17Z 2025-12-13T10:07:17Z Author&#160;Wu, Banqiu.&#160;Kumar, Ajay.&#160;Ramaswami, Sesh.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>