Search Results for Integration. - Narrowed by: Semiconductor wafers.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dIntegration.$0026qf$003dSUBJECT$002509Subject$002509Semiconductor$002bwafers.$002509Semiconductor$002bwafers.$0026ic$003dtrue$0026ps$003d300?2024-11-15T02:05:13ZThrough-silicon vias for 3D integrationent://SD_ILS/0/SD_ILS:2934782024-11-15T02:05:13Z2024-11-15T02:05:13ZAuthor Lau, John.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Handbook of 3D integration technology and applications of 3D integrated circuitsent://SD_ILS/0/SD_ILS:3036702024-11-15T02:05:13Z2024-11-15T02:05:13ZAuthor Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://lib.myilibrary.com?id=418217">Connect to MyiLibrary resource.</a>
John Wiley <a href="http://dx.doi.org/10.1002/9783527623051">http://dx.doi.org/10.1002/9783527623051</a>
ebrary <a href="http://site.ebrary.com/id/10577606">http://site.ebrary.com/id/10577606</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Silicon Wafer Bonding Technology for VLSI and MEMS Applicationsent://SD_ILS/0/SD_ILS:2477772024-11-15T02:05:13Z2024-11-15T02:05:13ZAuthor Iyer, S. S., ed. Auberton-Herv�, A. J., e<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP001E">http://dx.doi.org/10.1049/PBEP001E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>