Search Results for Integrity. - Narrowed by: Engineering.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dIntegrity.$0026qf$003dSUBJECT$002509Subject$002509Engineering.$002509Engineering.$0026ic$003dtrue$0026ps$003d300?2025-12-25T11:52:03ZSurface Integrity in Machiningent://SD_ILS/0/SD_ILS:1760912025-12-25T11:52:03Z2025-12-25T11:52:03ZAuthor Davim, J. Paulo. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-84882-874-2">http://dx.doi.org/10.1007/978-1-84882-874-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>China Satellite Navigation Conference (CSNC) 2013 Proceedings Satellite Navigation Signal System, Compatibility & Interoperability • Augmentation & Integrity Monitoring • Models & Methodsent://SD_ILS/0/SD_ILS:3344222025-12-25T11:52:03Z2025-12-25T11:52:03ZAuthor Sun, Jiadong. editor. Jiao, Wenhai. editor. Wu, Haitao. editor. Shi, Chuang. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(334422.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-642-37404-3">http://dx.doi.org/10.1007/978-3-642-37404-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>The Effect of Hydrogen and Hydrides on the Integrity of Zirconium Alloy Components Delayed Hydride Crackingent://SD_ILS/0/SD_ILS:1735452025-12-25T11:52:03Z2025-12-25T11:52:03ZAuthor Puls, Manfred P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4471-4195-2">http://dx.doi.org/10.1007/978-1-4471-4195-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>ICAF 2011 Structural Integrity: Influence of Efficiency and Green Imperatives Proceedings of the 26th Symposium of the International Committee on Aeronautical Fatigue, Montreal, Canada, 1-3 June 2011ent://SD_ILS/0/SD_ILS:2061352025-12-25T11:52:03Z2025-12-25T11:52:03ZAuthor Komorowski, Jerzy. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-94-007-1664-3">http://dx.doi.org/10.1007/978-94-007-1664-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Multiscale Fatigue Crack Initiation and Propagation of Engineering Materials: Structural Integrity and Microstructural Worthiness Fatigue Crack Growth Behaviour of Small and Large Bodiesent://SD_ILS/0/SD_ILS:1702072025-12-25T11:52:03Z2025-12-25T11:52:03ZAuthor Sih, G. C. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4020-8520-8">http://dx.doi.org/10.1007/978-1-4020-8520-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrityent://SD_ILS/0/SD_ILS:1650202025-12-25T11:52:03Z2025-12-25T11:52:03ZAuthor Leventhal, Roy G. author. Green, Lynne. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/b104647">http://dx.doi.org/10.1007/b104647</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>