Search Results for Microelectronic packaging -- Materials.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dMicroelectronic$002bpackaging$002b--$002bMaterials.$0026ic$003dtrue$0026ps$003d300?
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Advances in embedded and fan-out wafer level packaging technologies
ent://SD_ILS/0/SD_ILS:594706
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Author Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.<br/>Preferred Shelf Number TK7870.17 .A38 2019<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Progress in adhesion and adhesives. Volume 4
ent://SD_ILS/0/SD_ILS:595386
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Author Mittal, K. L., 1945- editor.<br/>Preferred Shelf Number TP968<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119625322">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119625322</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D Microelectronic Packaging From Fundamentals to Applications
ent://SD_ILS/0/SD_ILS:613043
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Author Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
ent://SD_ILS/0/SD_ILS:529599
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Author Voyiadjis, George Z. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4614-5589-9">https://doi.org/10.1007/978-1-4614-5589-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Adhesion in microelectronics
ent://SD_ILS/0/SD_ILS:341844
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Author Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.<br/>Preferred Shelf Number ONLINE(341844.1)<br/>Electronic Access ebrary <a href="http://alltitles.ebrary.com/Doc?id=10910126">An electronic book accessible through the World Wide Web; click to view</a>
Ebook Library <a href="http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917">http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917</a>
John Wiley <a href="http://dx.doi.org/10.1002/9781118831373">http://dx.doi.org/10.1002/9781118831373</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Nanotechnology for telecommunications
ent://SD_ILS/0/SD_ILS:541491
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Author Anwar, Sohail.<br/>Preferred Shelf Number TK5103 .N36 2010<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781315219479">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Microelectronic packaging
ent://SD_ILS/0/SD_ILS:540537
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Author Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)<br/>Preferred Shelf Number TK7870.15 .M53 2005<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781136942761">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>