Search Results for Microelectronic packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dMicroelectronic$002bpackaging.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?dt=list
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Microelectronic packaging
ent://SD_ILS/0/SD_ILS:290090
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Author Datta, Madhav. ?saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://marc.crcnetbase.com/isbn/9780203473689">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
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Author Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
ent://SD_ILS/0/SD_ILS:298653
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Author Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access Wiley InterScience <a href="http://dx.doi.org/10.1002/9780470827826">An electronic book accessible through the World Wide Web; click for information</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
ent://SD_ILS/0/SD_ILS:460117
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Author Suganuma, Katsuaki, editor.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Adhesion in microelectronics
ent://SD_ILS/0/SD_ILS:341844
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Author Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.<br/>Preferred Shelf Number ONLINE(341844.1)<br/>Electronic Access ebrary <a href="http://alltitles.ebrary.com/Doc?id=10910126">An electronic book accessible through the World Wide Web; click to view</a>
Ebook Library <a href="http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917">http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917</a>
John Wiley <a href="http://dx.doi.org/10.1002/9781118831373">http://dx.doi.org/10.1002/9781118831373</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
MEMS fundamental technology and applications
ent://SD_ILS/0/SD_ILS:285396
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Author Choudhary, Vikas. Iniewski, Krzysztof.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://marc.crcnetbase.com/isbn/9781466515826">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Semiconductor packaging materials interaction and reliability
ent://SD_ILS/0/SD_ILS:288970
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Author Chen, Andrea. Lo, Randy.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://marc.crcnetbase.com/isbn/9781439862070">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D IC stacking technology
ent://SD_ILS/0/SD_ILS:293493
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Author Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Introduction to microsystem packaging technology
ent://SD_ILS/0/SD_ILS:291551
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Author Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://marc.crcnetbase.com/isbn/9781439865972">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Quantum-well laser array packaging nanoscale packaging techniques
ent://SD_ILS/0/SD_ILS:293590
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Author Tomm, Jens W. Jim�enez, J. (Juan)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
MEMS/MOEMS packaging concepts, designs, materials, and processes
ent://SD_ILS/0/SD_ILS:293599
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Author Gilleo, Ken.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced electronic packaging
ent://SD_ILS/0/SD_ILS:249822
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Author Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-<br/>Preferred Shelf Number ONLINE<br/>Electronic Access IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced electronic packaging
ent://SD_ILS/0/SD_ILS:249765
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Author Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-<br/>Preferred Shelf Number ONLINE<br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
IC component sockets
ent://SD_ILS/0/SD_ILS:301581
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Author Liu, Weifeng. Pecht, Michael. John Wiley & Sons.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access John Wiley <a href="http://dx.doi.org/10.1002/0471648272">http://dx.doi.org/10.1002/0471648272</a>
Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html">http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>