Search Results for Microelectronics. - Narrowed by: Materials. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dMicroelectronics.$0026qf$003dSUBJECT$002509Subject$002509Materials.$002509Materials.$0026te$003dILS$0026ps$003d300?dt=list 2026-01-14T01:57:10Z Plasma applications for material modification : from microelectronics to biological materials ent://SD_ILS/0/SD_ILS:564303 2026-01-14T01:57:10Z 2026-01-14T01:57:10Z Author&#160;Tabar&eacute;s, Francisco L., editor.<br/>Preferred Shelf Number&#160;TA2020 .P53 2022<br/>Electronic Access&#160;Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003119203">https://www.taylorfrancis.com/books/9781003119203</a> OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials ent://SD_ILS/0/SD_ILS:190315 2026-01-14T01:57:10Z 2026-01-14T01:57:10Z Author&#160;Breitenstein, Otwin. author.&#160;Warta, Wilhelm. author.&#160;Langenkamp, Martin. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-3-642-02417-7">http://dx.doi.org/10.1007/978-3-642-02417-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Bonding in Microsystem Technology ent://SD_ILS/0/SD_ILS:169225 2026-01-14T01:57:10Z 2026-01-14T01:57:10Z Author&#160;Dziuban, Jan A. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/1-4020-4589-1">http://dx.doi.org/10.1007/1-4020-4589-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Selected Sensor Circuits From Data Sheet to Simulation ent://SD_ILS/0/SD_ILS:526887 2026-01-14T01:57:10Z 2026-01-14T01:57:10Z Author&#160;Baumann, Peter. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-658-38212-4">https://doi.org/10.1007/978-3-658-38212-4</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society ent://SD_ILS/0/SD_ILS:528603 2026-01-14T01:57:10Z 2026-01-14T01:57:10Z Author&#160;Cocorullo, Giuseppe. editor.&#160;Crupi, Felice. editor.&#160;Limiti, Ernesto. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-031-26066-7">https://doi.org/10.1007/978-3-031-26066-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Thermal Management Materials ent://SD_ILS/0/SD_ILS:331292 2026-01-14T01:57:10Z 2026-01-14T01:57:10Z Author&#160;Jiang, Guosheng. author.&#160;Diao, Liyong. author.&#160;Kuang, Ken. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE(331292.1)<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4614-1963-1">http://dx.doi.org/10.1007/978-1-4614-1963-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>