Search Results for Optical materials. - Narrowed by: System safety. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dOptical$002bmaterials.$0026qf$003dSUBJECT$002509Subject$002509System$002bsafety.$002509System$002bsafety.$0026ps$003d300? 2024-11-15T18:48:04Z The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ent://SD_ILS/0/SD_ILS:168463 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Grossmann, G&uuml;nter. editor.&#160;Zardini, Christian. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections ent://SD_ILS/0/SD_ILS:168486 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Tan, Cher Ming. author.&#160;Li, Wei. author.&#160;Gan, Zhenghao. author.&#160;Hou, Yuejin. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-85729-310-7">http://dx.doi.org/10.1007/978-0-85729-310-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Reliability of Microtechnology Interconnects, Devices and Systems ent://SD_ILS/0/SD_ILS:172420 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Liu, Johan. author.&#160;Salmela, Olli. author.&#160;Sarkka, Jussi. author.&#160;Morris, James E. author.&#160;Tegehall, Per-Erik. author.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5760-3">http://dx.doi.org/10.1007/978-1-4419-5760-3</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Verformung und Sch&auml;digung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich ent://SD_ILS/0/SD_ILS:191278 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Wiese, Steffen. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-3-642-05463-1">http://dx.doi.org/10.1007/978-3-642-05463-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Solder Joint Reliability Prediction for Multiple Environments ent://SD_ILS/0/SD_ILS:167673 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Perkins, Andrew E. author.&#160;Sitaraman, Suresh K. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Solder Joint Technology Materials, Properties, and Reliability ent://SD_ILS/0/SD_ILS:166252 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Tu, King-Ning. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics ent://SD_ILS/0/SD_ILS:166405 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Subramanian, K. N. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-48433-4">http://dx.doi.org/10.1007/978-0-387-48433-4</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> A Guide to Lead-free Solders Physical Metallurgy and Reliability ent://SD_ILS/0/SD_ILS:175373 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Evans, John W. author.&#160;Engelmaier, Werner. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-84628-310-9">http://dx.doi.org/10.1007/978-1-84628-310-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Force Sensors for Microelectronic Packaging Applications ent://SD_ILS/0/SD_ILS:181096 2024-11-15T18:48:04Z 2024-11-15T18:48:04Z Author&#160;Schwizer, J&uuml;rg. author.&#160;Mayer, Michael. author.&#160;Brand, Oliver. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>