Search Results for Packaging -- Design. - Narrowed by: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging$002b--$002bDesign.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ic$003dtrue$0026ps$003d300?
2026-02-23T10:12:35Z
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-02-23T10:12:35Z
2026-02-23T10:12:35Z
Author Lau, John H. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2026-02-23T10:12:35Z
2026-02-23T10:12:35Z
Author Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2026-02-23T10:12:35Z
2026-02-23T10:12:35Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Sensing technologies for real time monitoring of water quality
ent://SD_ILS/0/SD_ILS:598351
2026-02-23T10:12:35Z
2026-02-23T10:12:35Z
Author Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.<br/>Preferred Shelf Number TD367 .M3175 2023<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Substrate-integrated millimeter-wave antennas for next-generation communication and radar systems
ent://SD_ILS/0/SD_ILS:596619
2026-02-23T10:12:35Z
2026-02-23T10:12:35Z
Author Chen, Zhi Ning, editor. Qing, Xianming, editor. John Wiley & Sons, publisher.<br/>Preferred Shelf Number TK7871.6 .S83 2021<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119611165">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119611165</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2026-02-23T10:12:35Z
2026-02-23T10:12:35Z
Author Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>