Search Results for Packaging. - Narrowed by: Microelectronic packaging. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Microelectronic$002bpackaging.$002509Microelectronic$002bpackaging.$0026te$003dILS$0026ps$003d300? 2025-12-27T20:42:40Z Microelectronic packaging ent://SD_ILS/0/SD_ILS:540537 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Datta, Madhav.&#160;Osaka, Tetsuya, 1945-&#160;Schultze, J. W. (Joachim Walter)<br/>Preferred Shelf Number&#160;TK7870.15 .M53 2005<br/>Electronic Access&#160;<a href="https://www.taylorfrancis.com/books/9781136942761">Click here to view.</a><br/>Format:&#160;Books<br/>Availability&#160;Online Library~1<br/> Advanced electronic packaging ent://SD_ILS/0/SD_ILS:249765 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Brown, William D., 1943-&#160;Ulrich, Richard K. (Richard Kevin), 1955-<br/>Preferred Shelf Number&#160;ONLINE<br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced electronic packaging ent://SD_ILS/0/SD_ILS:249822 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Ulrich, Richard K. (Richard Kevin), 1955-&#160;Brown, William D., 1943-<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Semiconductor packaging : materials interaction and reliability ent://SD_ILS/0/SD_ILS:546600 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Chen, Andrea., author.&#160;Lo, Randy.<br/>Preferred Shelf Number&#160;TK7870.15 .C54 2012<br/>Electronic Access&#160;<a href="https://www.taylorfrancis.com/books/9781439862070">Click here to view.</a><br/>Format:&#160;Books<br/>Availability&#160;Online Library~1<br/> Introduction to microsystem packaging technology ent://SD_ILS/0/SD_ILS:546454 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Jin, Yufeng., author.&#160;Wang, Zhiping, 1962- Oct. 6-&#160;Chen, Jing, 1974-<br/>Preferred Shelf Number&#160;TK7870.15 .J56 2011<br/>Electronic Access&#160;<a href="https://www.taylorfrancis.com/books/9781315217086">Click here to view.</a><br/>Format:&#160;Books<br/>Availability&#160;Online Library~1<br/> MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Gilleo, Ken.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability ent://SD_ILS/0/SD_ILS:460117 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Suganuma, Katsuaki, editor.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Quantum-well laser array packaging nanoscale packaging techniques ent://SD_ILS/0/SD_ILS:293590 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Tomm, Jens W.&#160;Jim&#65533;enez, J. (Juan)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> MEMS : fundamental technology and applications ent://SD_ILS/0/SD_ILS:547455 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Choudhary, Vikas.&#160;Iniewski, Krzysztof.<br/>Preferred Shelf Number&#160;TK7875 .M457 2013<br/>Electronic Access&#160;<a href="https://www.taylorfrancis.com/books/9781315216393">Click here to view.</a><br/>Format:&#160;Books<br/>Availability&#160;Online Library~1<br/> 3D IC stacking technology ent://SD_ILS/0/SD_ILS:293493 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Wu, Banqiu.&#160;Kumar, Ajay.&#160;Ramaswami, Sesh.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> IC component sockets ent://SD_ILS/0/SD_ILS:301581 2025-12-27T20:42:40Z 2025-12-27T20:42:40Z Author&#160;Liu, Weifeng.&#160;Pecht, Michael.&#160;John Wiley &amp; Sons.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;John Wiley <a href="http://dx.doi.org/10.1002/0471648272">http://dx.doi.org/10.1002/0471648272</a> Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html">http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>